|*** Conference Topics of Interest ***
Integration: Interconnection Structure and Performance,
Parasitic Capacitance, Reliability Technology, Testing and Analysis
Reliability Science and Failure Analysis: EM, SIV, TDDB, Defect Detection
and Analysis, Failure Mechanism and Modeling
Metallization: PVD, CVD, ALD, Plating, Barrier Metal, New Material, Alloy, Supercritical Fluid, Reflow
Low-k Dielectric: CVD, ALD, SOD, Film Properties, New Materials,
Dielectric Structures (Air Gap), Metrology, etc.
CMP: Planarization Technology, Slurry, Pad, Dress, End Point Detection,
Cleaning, Anti-corrosive Technology, etc.
Contact: Silicide, Interface, Solid Phase Reaction, Shallow Junction, Crystal Properties, Electron Properties, Carrier Transport, etc.
MEMS/RF: Interconnection Structure and Materials, Packaging,
Fabrication Process Technology, Device Design, etc.
Emerging Technology: Active Wiring, Power Electronics, Silicon Photonics, Flexible Electronics, Energy Harvesting, etc.
Backend Device Technology: Tech. for Embedding Devices (MRAM,
PCRAM, ReRAM, DRAM etc.), Materials and Processing of Magnetics,
Phase-Change and Resistive-Change Devices, Electrode, Metallization, etc.
Nano Carbon: Graphene, Carbon Nanotube, Deposition, Integration,
Electrical Characteristics, Reliability, Evaluation, Analysis, etc.
3D and Packaging: TSV, TMV, Stacking Method (CoW, WoW), Thinning,
Planarization, Bonding, Bump, Stress and Thermal Analysis, Sealing,