Advanced Metallization Conference 2021
30thAnniversary, Asian Session


Tutorial Program
  This session will be conducted in Japanese.
October 12, 2021 (TUE)
12:45-12:55 Opening
No.1 13:00-13:40
Market outlook
  Nomura Securities Co., Ltd., Tetsuya Wadaki

No.2 13:50-14:30
Interconnection materials
  Air Liquide Japan G.K. Kazutaka Yanagita

No.3 14:40-15:20
Plasma etching process
  Nagoya University, Kenji Ishikawa

No.4 15:30-16:10
CMP process
  Showa Denko Materials Co., Ltd. Seiichi Kondo

No.5 16:20-17:00
3D NAND memory
  Western Digital Corporation, Naoki Takeguchi


October 13, 2021 (WED)
No.6  9:10-9:50
Integration
  IBM Research, Gen Tsutsui, Ph.D

No.7 10:00-10:40
CVD/ALD technologies
  Lam Research Corporation, Yukinori Sakiyama

No.8 10:50-11:30
3D integration / packaging technology
  National Institute of Advanced Industrial Science and Technology
  (AIST), Kenji Takahashi

No.9 11:40-12:20
AI and Materials Informatics
  National Institute for Materials Science(NIMS), Toyohiro Chikyow



   Tutorial   30th anniversary   Conference Program

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