Advanced Metallization Conference 2021
30thAnniversary, Asian Session


Tutorial Program
　　This session will be conducted in Japanese.
October 12, 2021 (TUE)
12:45-12:55　Opening
No.1　13:00-13:40
Market outlook
　　Nomura Securities Co., Ltd., Tetsuya Wadaki

No.2　13:50-14:30
Interconnection materials
　　Air Liquide Japan G.K. Kazutaka Yanagita

No.3　14:40-15:20
Plasma etching process
　　Nagoya University, Kenji Ishikawa

No.4　15:30-16:10
CMP process
　　Showa Denko Materials Co., Ltd. Seiichi Kondo

No.5　16:20-17:00
3D NAND memory
　　Western Digital Corporation, Naoki Takeguchi


October 13, 2021 (WED)
 No.6 　9:10-9:50
Integration
　　IBM Research, Gen Tsutsui, Ph.D

No.7　10:00-10:40
CVD/ALD technologies
　　Lam Research Corporation, Yukinori Sakiyama

No.8　10:50-11:30
3D integration / packaging technology
　　National Institute of Advanced Industrial Science and Technology
　　(AIST), Kenji Takahashi

No.9　11:40-12:20
AI and Materials Informatics
　　National Institute for Materials Science(NIMS), Toyohiro Chikyow

　　　Tutorial 　　30th anniversary 　　Conference Program

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