Keynotes Speakers
(1)Thin Film Metallurgy
M. Murakami
(Ritsumeikan Univ.)
(2)10 years of BEOL Wiring Innovations -
from Cu through Low-k to Airgaps
Dr. Daniel
Edelstein (IBM)
Invited Speakers
(1) STP Technology - Interconnects, CMOS,
MEMS, Packaging
N. Satoh
(NTT)
(2) Thermal Behavior of Advanced Interconnect
Systems
Thomas Gessner
(Chemnitz University of Technology）
(3) Porous SiCOH BEOL dielectrics for 45
and 32 nm CMOS Technologies
Stephen Gates
(IBM)
(4) Ru CMP For Bottom Electrode Fromation
Jin-Goo-Park
(Hangyang Univ.)
(5) Electrofill Challenges and Directions
for Future Device Generations
Jonathan
Reid (Novellus Systems)
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