ADMETAPlus2022
Advanced Metallization Conference 2022
31st Asian Session
About ADMETA Plus
Advanced Metallization Conference 2022
31st Asian Session
Oct. 12-14, 2022, Hybrid Conference (on site & online)
Oct.12: Tutorial
Oct.13-14 : Conference
Sponsored by
The Japan Society of Applied Physics
Co-Sponsored by
The Institute of Electronics, Infomration and Communication Engineers (IEICE)
The Japan Institute of Metals and Materials (JIM)
The Surface Finishing Society of Japan (SFJ)
The Japan Society for Precision Engineering (JSPE)
The Institute of Electrical Engineers of Japan (IEEJ)
The Japan Institute of Electronics Packaging (JIEP)
The Japan Society of Vacuum and Surface Science (JVS)
IEEE EDS Japan Joint Chapter
ECS Japan Section
Financially supported by
The Foundation for Technology Promotion of Electronic Circuit Board
31st Asian Session
Oct. 12-14, 2022, Hybrid Conference (on site & online)
Oct.12: Tutorial
Oct.13-14 : Conference
Sponsored by
The Japan Society of Applied Physics
Co-Sponsored by
The Institute of Electronics, Infomration and Communication Engineers (IEICE)
The Japan Institute of Metals and Materials (JIM)
The Surface Finishing Society of Japan (SFJ)
The Japan Society for Precision Engineering (JSPE)
The Institute of Electrical Engineers of Japan (IEEJ)
The Japan Institute of Electronics Packaging (JIEP)
The Japan Society of Vacuum and Surface Science (JVS)
IEEE EDS Japan Joint Chapter
ECS Japan Section
Financially supported by
The Foundation for Technology Promotion of Electronic Circuit Board
The ADMETAPlus is heading for the 31st historical meeting and has a long record of important contributions to practical progress for advanced MPU and various memory devices. In recent years, the importance of interconnect technology for realizing low resistance, large integration, rich function, low cost, and high reliability is increasing in various device application fields beyond silicon electronics.
This conference is focusing interconnects technology and science related to materials, processes, device design, assembly, equipment, cost performance, and characterization. We will conduct comprehensive discussions widely from basics to applications with researchers and engineers from industry, government, and academia. We are looking forward to new developments in interconnect technology fields and contributing to the growth of semiconductor industry in the Asian area. Due to the infection status of the COVID-19, ADMETAPlus 2022 will be held virtual and live Hybrid events.
This conference is focusing interconnects technology and science related to materials, processes, device design, assembly, equipment, cost performance, and characterization. We will conduct comprehensive discussions widely from basics to applications with researchers and engineers from industry, government, and academia. We are looking forward to new developments in interconnect technology fields and contributing to the growth of semiconductor industry in the Asian area. Due to the infection status of the COVID-19, ADMETAPlus 2022 will be held virtual and live Hybrid events.
ADMETAPlus 2022 General Chair: Hideaki Machida (Hideaki Machida)
[Co-Organizer]
[Exhibitor’s Link]
[Sponsors’ Link]
