ADMETA is approaching its 34th annual meeting and has a long history of important contributions to state-of-the-art interconnect progress for advanced logic and memory devices. This year, the name ADMETA was shortened by removing “plus” and “Asian session,” which redefined it as a unique international conference that focuses on interconnect formation processes.

ADMETA covers interconnect technology, including materials, processes, equipment, devices, circuit design, integration, characterization, assembly, and packaging. We will comprehensively discuss topics ranging from fundamentals to applications, together with researchers and engineers from industry, government, and academia.

Advanced semiconductor devices continue to attract growing global attention, and a similar level of excitement has been growing in Japan over the past two or three years. We look forward to novel developments in the field of interconnect technology. In particular, we hope that the latest interconnect technology from Japan will continue advancing and contributing to the global semiconductor industry’s growth.

The theme for ADMETA 2025 is “Cutting-edge device technology through the fusion of interconnect technology and new concepts.” Based on this theme, we plan to offer an appealing program, including a tutorial session (conducted in Japanese only), plenary talks, invited talks, and a poster session.

We look forward to seeing you in Tokyo and hope you enjoy ADMETA 2025.

ADMETA 2025 General Chair: Takeyasu Saito (Osaka Metropolitan University)