ADMETAPlus2022
Advanced Metallization Conference 2022
31st Asian Session
招待講演
[Conference Plenary Speakers]
1) Global Trend of Automotive Devices and Renesas Technology Strategy
Mr. Shinichi Yoshioka (Renesas Electronics Corporation)
Mr. Yoshioka serves as the Senior Vice President and CTO at Renesas. He was appointed to these roles in August 2019, from his experience and technological expertise of the products and the market following the years he has dedicated to Renesas. He began his career in Hitachi, Ltd in 1986. Since Renesas Electronics Corporation was established in 2010 based on Hitachi, Mitsubishi Electric, and NEC Electronics, he has held many key roles, such as the Vice President of Automotive Control and Analog & Power Systems Business Division, Safety Solution Business Division, and the Senior Vice President of the Automotive Solutions Business Unit. He has a Bachelor of Engineering degree in Applied Physics from the University of Tokyo and graduated from Stanford University with a Master of Science in Electrical Engineering.
2) Small, Big, Great– Semiconductor Technology Opportunities
Dr. Myung Hee Na (SK hynix)
Dr. Myung Hee Na is the Vice President of Research Division at SK hynix. Having recently joined at SK hynix, she is responsible for leading next-generation memory technology research. Prior to joining SK hynix, she was the Vice President of Technology Solutions and Enablement at imec where she was responsible for CMOS technology research for advanced CMOS and AI technology. After completing her Ph.D in Physics, Dr. Na started her career at IBM in 2001, where she held various technical, managerial and executive roles until early 2019. During that time, she was promoted to Distinguished Engineer and Technical Executive. At IBM Research, she successfully led Research and Development for multiple generations of semiconductor technologies, including high-K metal gate, FinFET, and Nanosheet development. She received several Outstanding Technical Achievement Awards for her technical contributions. Moreover, she has co-authored numerous research papers and holds several U.S. and international patents
[Invited Speakers]
・Advanced Integration and Processes
1) Atomic Layer and Conformal Etching Technologies of 3D Structures in
Advanced Logic and Memory Devices
Dr. Hiroto Ohtake (Hitach High-Tech Corporation)
2) BEOL Materials, Processes and Integration toward 3 nm and 2 nm
Dr. Takeshi Nogami (IBM Corp.)
・Advanced Metallization
1) Two-Dimensional Materials and Devices: Advanced Contacts, Interconnects
and 3D Systems
Prof. Tomas Palacios (MIT)
2) Alternative metals for logic and memory interconnects
Dr. Christoph Adelmann (imec)
・CMP
1) CMP Challenges and solutions for low resistance wiring and backside
power distribution network applications
Dr. Jianshe Tang (Applied Materials)
・Emerging Technology
1) Overcoming the Data Deluge Challenges with Greener Electronics
Dr. Vincent Barral (CEA-Leti)
2) Low-Energy Self-Heated Molecular Sensors for Ubiquitous Health Monitoring
Prof. Ken Uchida (The University of Tokyo)
・Thin films and dielectrics
・3D, TSV, PKG
1) Characterization for Multi-layer Films Grown by Atomic Layer Deposition
and Backside Metallization
Dr. Junichiro Sameshima (Toray Research Center, Inc.)
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