ADMETA 2025
Advanced Metallization Conference 2025
Topics of interest
◆Integration: Interconnect Structure and Performance, Parasitic Capacitance, Reliability Technology, Testing and Analysis
◆Reliability: Science and Failure Analysis, EM, SIV, TDDB, Defect Detection and Analysis, Failure Mechanism and Modeling
◆Metallization: PVD, CVD, ALD, Plating, Barrier Metal, New Material, Alloy, Supercritical Fluid, Reflow
◆Interconnects patterning: Etching, Lithography, Advanced Patterning, Hard Mask, Pattern Transfer, SAMs,
◆Low-k Dielectric: CVD, ALD, SOD, Film Properties, New Materials, Dielectric Structures (Air Gap), Metrology
◆CMP: Planarization Technology, Slurry, Pad, Dress, End Point Detection, Cleaning, Anti-corrosive Technology
◆Contact: Silicide, Interface, Solid Phase Reaction, Shallow Junction, Crystal Properties, Electron Properties, Carrier Transport
◆MEMS/RF: Interconnection Structure and Materials, Packaging, Fabrication Process Technology, Device Design
◆Emerging Technology: Active Wiring, Power Electronics, Silicon Photonics, Flexible Electronics, Energy Harvesting
◆Backend Device Technology: Tech. for Embedding Devices (MRAM, PCRAM, ReRAM, DRAM etc.), Materials and Processing of Magnetics, Phase-Change and Resistive-Change Devices, Electrode, Metallization
◆Nano Carbon and 2D materials: Graphene, CNT, Transition-metal Dichalcogenide, Deposition, Integration, Electrical Characteristics, Reliability, Evaluation, Analysis
◆3D and Packaging: TSV, TMV, Stacking Method (CoW, WoW), Heterogeneous Integration, Thinning, Planarization, Mold Compound, Bonding, Bump, Stress and Thermal Analysis, Sealing, Cooling, Reliability
Conference Topics: October 9-10, 2025 (in English)
◆Advanced Integration and Process
◆Advanced Metallization
◆CMP and Cleaning
◆Emerging Technologies
◆Next Generation Interconnect (Carbon, Optical Interconnect etc.)
◆Thin films and Dielectrics
◆3D Device, TSV and Packaging
Tutorial Topics: October 8, 2025 (in Japanese)
◆Semiconductor Market Trend
◆Logic Integration (FEOL)
◆BEOL Integration and reliability
◆Memory (DRAM or/and NAND)
◆3D Packages
◆CVD/ALD
◆Etching
◆Metal
◆CMP
* The full list of invited speakers and tutorial lecturers will be announced later.
** The official language of the tutorial lecturers is Japanese.
