Conference Keynotes 講演者
（１）Business Strategy and challengies for
Interconnect technology.
齋藤 昇三（東芝）
（２）Albany is global HOT spot --Message
from Albany, NY
平山 誠（ニューヨーク州立大学）
Conference 特別セッション講演者
（１）Effects of Scaling and Grain Structure
on Cu Electromigration and Structural Reliability
of Air-gap Interconnects
Paul Ho （テキサス大学）
（２）Scaling Impacts and Challenges on Reliability
in Cu / low-k
横川 慎二 （NECEL）
（３）Cu-drift induced electric leakage during
TDDB test in damascene Cu interconnect
Young-Chang Joo （ソウル大学）
Conference 招待講演者
(１）Ionized-PVD Stacked Barrier Structure
of TaN/TaRu for 32nm BEOL Integration
野上 毅 （IBM）
(２） Engineering of Chemical and Physical
Properties of low-k materials by different
wavelength of UV ｌight
Mikhail Baklanov （IMEC）
(３）Challenges in Planarization for sub-32nm
Logic Technology
Yongsik Moon (AMD)
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