On the day preceding the conference, a short
course summarizing the current status of
advanced ULSI metallization and interconnects
will be presented, utilizing the collective
wisdom of several leaders in the field.
Official language of the short course is
Japanese, and presentation and discussion
will be made by Japanese.
Tutorial Program
1) Cu/Low-k & Integration, Shunichi Fukuyama (Fujitsu Semiconductor)
2) Low-k, Tatsuya Usami (Renesas Electronics)
3) Dry etching, Hisataka Hayashi (Toshiba）
4) Market Tred, Wtaru Izumiya (The Semiconductor Industry News）
5) Metal, Kazuhiro Ito (Kyoto University)
6) CMP, Hiroyuki Chibahara (Renesas Electronics)
7) Carbon Nano Tube, Tadashi Sakai (Toshiba)
8) Packaging, Hiroshi Okazaki (NTT DOCOMO)
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