Structure and Performance, Parasitic Capacitance, Reliability Technology,
Testing and Analysis
Science and Failure Analysis: EM, SIV, TDDB, Defect Detection
and Analysis, Failure Mechanism and Modeling
CVD, ALD, Plating, Barrier Metal, Seed and Nucleation Layer, Supercritical
Dielectric: CVD, ALD, SOD, Film Properties, Interface Control,
New Materials, Dielectric Structures (Air Gap), Metrology, etc.
Planarization Technology, Slurry, Pad, Dress, End Point Detection, Cleaning, Anti-corrosive
Silicide, Interface, Solid Phase Reaction,
Shallow Junction, Crystal Properties, Electron Properties, Carrier Transport, Parasitic
Structure and the materials, Packaging, Fabrication Process Technology, Device
Wiring, Power Electronics, Silicon Photonics, Flexible Electronics, Energy
Device Technology: Technology for Embedding Devices (MRAM,
PCRAM, ReRAM, DRAM etc.), Materials and Process of Magnetics, Phase-Change and
Resistive-Change Devices, Electrode, Metallization, etc.
Graphene, Carbon Nanotube, Deposition, Integration, Electrical Characteristics,
Reliability, Evaluation, Analysis, etc.
and Packaging: TSV, TMV,
Stacking Method (CoW, WoW), Thinning, Planarization, Bonding, Bump, Stress and
Thermal Analysis, Sealing, Cooling, Reliability