On the day preceding the conference, a short
course summarizing the
current status of
advanced ULSI metallization
and interconnects
will be presented, utilizing
the collective
wisdom of several leaders
in the field.
*Official language of the
short course is
Japanese, and presentation
and discussion
will be made by Japanese.
Tutorial Program
1) Cu/Low-k Integration, Fuminori Ito (Renesas Electronics))
3) Lithography, Masayuki Endo (Osaka University)
3) Optical Interconnects/Si Photonics, Kazumi Wada (the University of Tokyo)
4) Market Trend, Yosuke Mochizuki (Nikkei BP Cleantech Institute)
5) CVD Equipment, Hironori Yamada (Novellus Systems)
6) Metal, Kazuyoshi Maekawa (Renesas Electronics)
7) CMP/Cleaning, Hitoshi Morinaga (Fujimi Incorporated)
8) Failure Analysis, Kiyoshi Nikawa (Osaka University)
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