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Dear Colleagues
Advanced Metallization Conference 2013, 23rd Asian Session (ADMETAPlus 2013) will be held from October 7 through
10, 2013. The conference
is organized to
stimulate and enhance the
research and development
of ULSI interconnect technology.
In every
year since 1989, the conference
has been
held at about the same
time in both Japan
(ADMETA) and USA (AMC),
and ADMETA has showcased
remarkable interconnect
technology development
in Asia.
Current active development of Cu multilayer
wiring technology is aimed
at feature sizes
of less than 50nm, and
application of Cu
wiring has been broadened
to be widely used
for Flash and DRAM. Securing
good reliability
for electromigration and
low-k films in cutting-edge
low-k/Cu wiring schemes
is an important area
of interest. There have
been advancements
in the introduction of
metal deposition for
front end processes such
as for silicides
and metal gates, and this
area is also covered
by ADMETA. The progress
of miniaturization
technology for packaging
is rapid, and concepts
for integrated wiring technology
between
Si chips and mounting substrates
are required.
3D wiring technology is
currently paid special
attention as an important
direction for further
device integration. Contributions
of papers
addressing these topics
are being highly
solicited as well as papers
in related areas
such as interconnect materials,
interconnect
design, reliability, process
equipment, and
cost reduction, etc. where
there is no shortage
of problems to be solved.
In addition to the main conference with its
emphasis on the direction of conventional
wiring scaling, four Organized Sessions (Backend
Device Technologies, Nanocarbon, 3D Challenges,
CMP), will be held to discuss post-scaling
technologies that are either under development
or in concept stage.
This conference offers an excellent opportunity
to learn about the most
recent R&D activities
in interconnect technology
and related fields
from researchers around
the world. We look
forward to your attendance.
ADMETAPlus 2013 General Chair:
Junichi Koike (Tohoku University)
ADMETAPlus 2013 Program Chair:
Fuminori Ito (Toshiba)
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