On the day preceding the conference, a short
course summarizing the
current status of
advanced ULSI metallization
and interconnects
will be presented, utilizing
the collective
wisdom of several leaders
in the field.
*Official language of the short course is
Japanese , and presentation and discussion
will be made by Japanese except for 5).
Tutorial Program
1) Low-k Integration Tamotsu Owada (Fujitsu
Semiconductor)
2) Image Sensor Nobukazu Teranishi ( Univ. of
Hyogo, Shizuoka Univ.)
3) SiC Device Hiroshi Yano（Nara Institute
of Science and Technology）
4) Marketing (Semiconductors)
Tetsuya Wadaki
(Nomura Securities)
5) 3D (TSV) Sunil Wickramanayaka（Institute
of Microelectronics）
6) Basis of CVD Motoaki
Kawase (Kyoto Univ.)
7) Metal Satoshi Kawashima (Meltex)
8) CMP Manabu Tsujimura (Ebara)
|
