Advanced Metallization Conference 2017: 27th Asian Session
Oct. 18-20, 2017,
Hongo Campus, The University of Tokyo, Tokyo
Oct. 18: Tutorial
Oct. 19-20 : Conference
Sponsored by
ADMETA Committee
Co-sponsored by
The Japan Society of Applied
Physics
Supported by
The Surface Finishing Society of Japan,
The Institute of Electrical Engineers
of
Japan,
The Japan Society for Precision Engineering,
The Institute of Electronics, Information
and Communication Engineers,
The Japan Institute of Metals and Materials,
The Vacuum Society of Japan,
The Surface Science Society of
Japan.
The Japan Institute of Electronics Packaging
IEEE EDS Japan Chapter
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The ADMETAPlus has been heading for the 27th historical meeting and long
contributed to practical progress for advanced MPU and various memory devices.
In recent years, the importance of interconnect technology for realizing
low resistance, large integration, rich function, low cost, and high reliability
is increasing more and more in various device application fields beyond
silicon electronics. This conference is focusing interconnects technology
and science related to materials, processes, device design, assembly, equipment,
cost performance, and characterization. We will conduct comprehensive discussions
widely from basics to applications with researchers and engineers from
industry, government, and academia. We are looking forward to newly developing
interconnect technology fields and also contributing the growth of semiconductor
industry in the Asian area.
ADMETAPlus 2017 General Chair:
Osamu Nakatsuka (Nagoya University)
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