Advanced Metallization Conference 2016: 26th Asian Session
Oct. 19-21, 2016,
Hongo Campus, The University of Tokyo, Tokyo
Oct. 19: Tutorial
Oct. 20-21 : Conference
Sponsored by
ADMETA Committee
Co-sponsored by
The Japan Society of Applied
Physics
Supported by
The Surface Finishing Society of Japan,
The Institute of Electrical Engineers
of
Japan,
The Japan Society for Precision Engineering,
The Institute of Electronics, Information
and Communication Engineers,
The Japan Institute of Metals and Materials,
The Vacuum Society of Japan,
The Surface Science Society of
Japan.
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Dear Colleagues
"Advanced Metallization Conference 2016: 26th Asian Session"
will be held in October, 2016.
ADMETA has its over 20 years history of a conference on the state-of-the-art interconnect technology which has contributed considerably on the development of integrated circuits including MPUs, DRAMs and Flash memories. Reliability issues in Low-k / Cu interconnect is still of great importance to meet the demand for high-density interconnect in future ULSIs, and therefore, emerging nano-carbon materials, air-gap technologies, as well as backend devices like MRAMs and ReRAMs embedded in interconnect layers are currently developed. Packaging is also facing to the down scaling of form factor and thus new interconnects bridging from silicon chips and PCB is required. In particular, 3D interconnect technologies based on TSV is attracting much attention as a promising future technology. ADMETA will focus on process, design, reliability, production tool, material and cost-reduction technologies, and discuss both scientific and engineering approaches to solve those issues.
ADMETAPlus 2016 General Chair:
Takenao Nemoto (Tokyo Electron)
ADMETAPlus 2016 Program Chair:
Shinji Yokogawa (The University of Electro-Communications)
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