Advanced Metallization Conference 2008: 18th Asian Session
Oct. 8-10, 2008,
Sanjo Conferene Hall, The Univ. of Tokyo, Tokyo
Oct. 8: Tutorial
Oct. 8 : Workshop
Oct. 9-10 : Conference
Oct. 10 : Special Session
Sponsored by
ADMETA Committee, The Japan Society of Applied Physics Silicon Technology Division
Supported by
the Univ. Tokyo, the Surface Finishing Society of Japan, The Institute of Electrical Engineers of Japan,
The Japan Society for Precision Engineering, the Institute of Electronics, Information and Communication Engineers, the Japan Institute of Metals, IEEE Japan Council, the Vacuum Society of Japan,
The Surface Science Society of Japan.
Dear Sir,
Advanced Metallization Conference 2008, 18th Asian Session: ADMETA 2008 will be held from October 8 to 10, 2008. The conference is organized to stimulate and enhance the research and development of ULSI interconnect technology; and each year since 1989 the conference has been held at about the same time in both Japan and USA, and has showcased remarkable interconnect technology development in Asia. Current active development of Cu multilayer wiring technology is aimed at feature sizes of less than 50nm. Securing good reliability between barrier metal and low k in Low k/Cu wiring schemes has become an important topic. In addition, the application of Cu wiring has been broadened to the memory market and is widely used for Flash and DRAM. Moreover, there is advancement in the introduction of metal deposition for transistor surroundings such as for Silicide and Metal Gate, etc. The progress of miniaturization technology for packaging is rapid, and concepts for integrated wiring technology between Si chips and mounting substrates are requested. Contributions of papers are highly solicited addressing these topics, and related areas such as materials, interconnect design, reliability, equipment, and cost reduction, etc. where there is no shortage of problems to be solved.
In addition to the main conference, from this year a new workshop and special session will be held to address the problems of future interconnect technology. Each year the workshop will have the theme “Next Generation Interconnects”. Each year a new theme will be picked for the special session, and this year’s theme is “Reliability”
This conference offers an excellent opportunity to learn about the most recent R&D activities in interconnect metal deposition and related fields from around the world. Now is the time for you to join us.
ADMETA 2008 Chairman:
Takashi Yoda (Toshiba）
ADMETA 2008 Program Chairman:
Kazuyoshi Ueno (Shibaura Institute of Technology)
ADMETA 2008 Public Relations Chairman:
Takuya Fukuda (Future Advanced Technology Research Laboratory)
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