Keynotes Speakers
(1) Business Strategy and challengies for
Interconnect technology.
Shozo Saito （Toshiba）
(2) Albany is global HOT spot --Message from
Albany, NY
Makoto Hirayama (New York State
University)
Invited Speakers
Special Session (Reliability) Speakers
(1)Effects of Scaling and Grain Structure
on Cu Electromigration and Structural Reliability
of Air-gap Interconnects
Paul Ho (University
of Texas)
(2) Scaling Impacts and Challenges on Reliability
in Cu / low-k
Shinji Yokogawa (NEC Electronics)
(3)Cu-drift induced electric leakage during
TDDB test in damascene Cu interconnect
Young-Chang Joo (Seoul University）
Conference Invited Speakers
(1) Ionized-PVD Stacked Barrier Structure
of TaN/TaRu for 32nm BEOL Integration
Takeshi Nogami （IBM）
(2) Engineering of Chemical and Physical
Properties of low-k materials by different
wavelength of UV ｌight.
Mikhail. Baklanov （IMEC）
(3) Challenges in Planarization for sub-32nm
Logic Technology
Yongsik Moon (AMD) |
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