Advanced Metal Conference 2018: 28th Asian Session (ADMETAplus 2018) will be hold from October 10th in China for the first
time and in conjunction with the 3rd International Workshop “Materials
for Advanced Interconnects and Packaging” (MAIP).
The ADMETAPlus is heading for its 28th historical meeting, which is organized
to stimulate and enhance the researcher and development of ULSI interconnect
technology since 1989, and has a long record of important contributions
to practical progress for advanced MPU and various memory devices. In recent
years, the importance of interconnect technology for realizing low resistance,
large integration, rich functionality, low cost, and high reliability has
increased in various device application fields beyond silicon electronics.
This conference will focus on interconnect technology and science related
to materials, processes, device design, assembly, equipment, cost performance,
and characterization. We will host comprehensive discussions on a wide
range of topics, from basics to applications, with researchers and engineers
from industry, government, and academia. We are looking forward to new
developments in interconnect technology fields and contributing to the
growth of the semiconductor industry in the Asian area. Now is the time
for you to join us.
ADMETAPlus 2018 General Chair:
Tianchun YE (Chinese Academy of Science)
Chao ZHAO (Chinese Academy of Science)
Xun GU (SanDisk Limited)
Ying SHI (ICTIA & ICMtia)
Mikhail BAKLANOV (North China Univ. of Tech.)