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Advanced Metallization Conference 2018
28th Asian Session
 Conference Invited Speakers

Conference Keynote Speaker:
  *Dr. Peng Bai*
 Vice President
 Technology & Manufacturing
 * Intel Corporation, USA*

Dr. Peng Bai is a corporate vice president and serves as co-director of the Logic Technology Development organization in the Technology and Manufacturing Group at Intel Corporation. Logic Technology Development is responsible for the development and transfer of next-generation silicon technologies that will produce future Intel microprocessors and system-on-chip designs.

Dr. Bai has held various engineering and management positions in the Logic Technology Development organization and worked on multiple generations of process technologies. He was in charge of system-on-chip process technology development and was manager of Intel’s D1C fabrication plant. He served as program manager for the company’s 65-nanometer (65nm) process technology development, yield manager for 130nm and 90nm technologies, process integration manager for 180nm technology, and process integration engineer for 350nm and 500nm technologies. Bai joined Intel in 1991.

   Dr. Bai received his bachelor’s degree in physics from the University of Bucharest in Romania and earned his Ph.D. from Rensselaer Polytechnic Institute in New York.

   * Dr. Meisheng Zhou*
 Executive Vice President
 Technology Research and Development
 * Semiconductor Manufacturing International Corporation, China*
 Dr. Meisheng Zhou, is an Executive Vice President of Technology Research and Development in Semiconductor Manufacturing International Corporation (SMIC) since 2017. Dr. Zhou is one professional of the “National Recruitment Program of Global Experts (abbreviation of the overseas high-level talent introduction plan). Before she joined the company, she has ever conducted various levels of management positions in Chartered Semiconductor Manufacturing, TSMC, UMC, Global Foundries and Lam Research.

Dr. Zhou received BSc and MSc degrees from Fudan University China in 1982 & 1985 respectively, and Ph.D. degree in Chemistry from Princeton University in 1990. Equipped with more than 20 years’ experience in world’s leading foundry companies, Dr. Zhou has accumulated extensive and rich management experience in advanced technology R&D, technical cooperation, technology transfer, verification of mass production, the start-up operation/mass production/operation of 12” Fab, and gradually shaped her own distinctive management philosophy. Specialized in module device, process and integrated technology, Dr. Zhou has been awarded with more than 130 US patents and published over 40 papers as co-inventor/author.

Conference Invited Speaker:

1. Prof. Larry Zhao, Technical Director, Lam Research, USA
 (Tentative) Overview of AMC/IITC 2018

2. Dr. Kang Sub Yim, Distinguished Member of Technical Staff, Applied Materials, USA
 Black Diamond low-k applications for advanced logic and memory

3. Prof. Junichi Koike, Tohoku University, Japan
 New materials for BEOL and MOL metallization beyond 5 nm node

4. Prof. Chih Chen, National Chiao Tung University
 (Tentative) Copper Metallization, especially nano-twinned copper

5. Prof. Maxime Darnon, CEA LETI, France
 Interaction of humidity with plasma-damaged porous low-k

6. Dr. Hyung Woo Kim, Principal Member of Technical Staff, GLOBALFOUNDRIES, USA
 BEOL integration Challenges beyond 7nm

7. Dr. David Thompson, Director, Applied Materials, USA
 (Tentative) Selective deposition

8. Dr. Yunlong Li, Senior Research Scientist, imec, Belgium
 Dielectric reliability in Wafer to Wafer interconnects

9. Prof. Z.D. Kvon, Institute of Semiconductor Physics, Russia
 Interconnects and topological insulators: myphs and reality

10. Dr. Ruth Shima-Edelstein, Manager, TowerJazz, Israel
 Back end integration in GaN foundry HV process

11. Prof. Mansun Chan, The Hong Kong University of Science and Technology
 Carbon Enhanced BEOL Technology

12. Prof. Kuan-Neng Chen, National Chiao Tung University
 (Tentative) 3D Packaging

13. Prof. Xia Xiao, Tianjin University
 Evaluation of adhesion forces by using surface acoustic waves

*Further details will be posted later.


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