Keynotes Speakers
(A) Yukio Sakamoto (Elpida Memory）
Be The World's No.1
(B) Hans Stork (Applied Materials)
Enabling 3D - process technologies
for devices,
interconnect and packaging
Conference Invited Speakers
(1) Stefan Schulz (Chemnitz University of
Technology);
Copper Films Grown via Copper Oxide ALD:
Routes and Challenges for Integration into
Next-Generation Interconnects
(2) Qinghung Lin (IBM Watson Research Center)
Integration of Photo-Patternable
Low-K Materials
into Advanced Cu BEOL
(3) Martin Gall (Freescale Semiconductor)
Large-Scale Statistical Evaluation of Early
Failures and Short-Length Effects in Cu Electromigration
(4) David Lazovsky (Intermolecular)
Application of High-Productivity
Combinatorial（HPC）
Technology to Cu/Low-k
Process
(5) Koei Suzuki （Ricoh）
Novel Printing Process of Organic TFT Backplane
for Flexible Electronic Paper
(6) Ara Philipossian （The University of
Arizona）
Kinetic and Tribological Fundamentals of
CMP processes
(7) Shigeaki Zaima （Nagoya
University）
Contact Technology for Nano-Scaled CMOS
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