Advanced Metal Conference 2018: 28th Asian Session (ADMETAplus 2018) will be hold from October 10th in China for the first time and in conjunction with the 3rd International Workshop “Materials for Advanced Interconnects and Packaging” (MAIP).
The ADMETAPlus is heading for its 28th historical meeting, which is organized to stimulate and enhance the researcher and development of ULSI interconnect technology since 1989, and has a long record of important contributions to practical progress for advanced MPU and various memory devices. In recent years, the importance of interconnect technology for realizing low resistance, large integration, rich functionality, low cost, and high reliability has increased in various device application fields beyond silicon electronics. This conference will focus on interconnect technology and science related to materials, processes, device design, assembly, equipment, cost performance, and characterization. We will host comprehensive discussions on a wide range of topics, from basics to applications, with researchers and engineers from industry, government, and academia. We are looking forward to new developments in interconnect technology fields and contributing to the growth of the semiconductor industry in the Asian area. Now is the time for you to join us.

ADMETAPlus 2018 General Chair:
Tianchun YE (Chinese Academy of Science)

General Co-chair:
Chao ZHAO (Chinese Academy of Science)
Xun GU (SanDisk Limited)
Ying SHI (ICTIA & ICMtia)

Program Chair:
Mikhail BAKLANOV (North China Univ. of Tech.)