Low-k Dielectric: CVD, ALD, SOD, Film Properties, Interface Control, New Materials, Dielectric
Structures (Air Gap), Selective Deposition as New Patterning Strategy,
Surface Confined Activation of Low-k Materials, Metrology, etc.
Metallization: PVD, CVD, ALD, Plating, Barrier Metal, Seed and Nucleation Layer, Supercritical
Fluid, Reflow
CMP: Planarization Technology, Slurry, Pad, Dress, End Point Detection, Cleaning,
Anti-corrosive Technology, etc.
Integration: Interconnection Structure and Performance, Parasitic Capacitance, Reliability
Technology, Testing and Analysis, Alterative Integration Approach based
on Subtractive Approach, etc.
Reliability Science and Failure Analysis: EM, SIV, TDDB, Defect Detection and Analysis, Failure Mechanism and Modeling.
Contact: Silicide, Interface, Solid Phase Reaction, Shallow Junction, Crystal
Properties, Carrier Transport, Parasitic Resistance, Nanocontact etc.
MEMS/RF: Interconnection Structure and Materials, Packaging, Fabrication Process Technology, Device Design, etc.
Emerging Technology: Active Wiring, Power Electronics, Silicon Photonics, Flexible Electronics,
Energy Harvesting, etc.
Backend Device Technology: Technology for Embedding Devices (MRAM, PCRAM, ReRAM, DRAM, etc.), Materials and Processing of Magnetics, Phase-Change and Resistive-Change Devices, Electrodes, Metallization, etc.
Nanocarbon: Graphene, Carbon Nanotubes, Deposition, Integration, Electrical Characteristics,
Reliability, Evaluation, Analysis, etc.
3D and Packaging: TSV, TMV, Stacking Method (CoW, WoW), Thinning, Planarization, Bonding, Bump, Stress and Thermal Analysis, Sealing, Cooling, Reliability etc.
Modeling and Simulation: Advanced Metallization and IC Thermal Management.
|
|
