Oct.10th, 2018
9:00-9:10
Opening remarks
Xun Gu, Tutorial Chair (SanDisk Limited)
9:10-10:00
From low cost manufacturer to worldwide partner --Repositioning Chinese
IC Industry
Tian-chun Ye (President of Institute of Microelectronics, Chinese Academy
of Science)
10:00-10:50
Black Diamond --Low-k to Ultralow-k and Beyond
Kang Sub Yim (Distinguished Member of Technical Staff, Applied Materials, USA)
10:50-11:20
Break Time
11:20-12:10
Introduction to plasma etching of porous low-k films
Maxime Darnon (Researcher/adjunct professor, CNRS/Universite de Sherbrooke, Canada)
12:10-13:30
Lunch
13:30-14:20
Challenges & Requirements of BEOL Integration in sub-10nm
Hyung Woo Kim (Senior Manager/Deputy Director, GLOBALFOUNDRIES, USA)
14:20-15:10
Semiconductor Wet Cleaning, CMP, and Contamination Control in Wet Process
Hitoshi Morinaga (Senior General Manager, FUJIMI Incorporated, Japan)
15:10-15:40
Break Time
15:40-16:30
Backed-end-of-line Reliability: Metal migration and low-k breakdown
Yunlong Li (Senior R&D Engineer, imec, Belgium)
16:30-17:20
3D Integration for Advanced Packaging
Kuan-Neng Chen (Professor/IEEE Fellow, National Chiao Tung University)
18:00-19:30
Dinner Banquet
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