Advanced Metallization Conference 2021
30thAnniversary, Asian Session
Chapter 1:
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Since 2008, ADMETA has been full of the latest presentations on interconnection technologies, mainly Cu, low-k, and barrier metals. Table 1 shows the top 10 most frequently used words in the titles of papers presented at ADMETA since 2008. Cu, low-k, and barrier metal were on the list for the past ten years, indicating that they have been the main topics at ADMETA. Note that the word "low" is used for both low-k and low-temperature, so "k" is considered to indicate the actual frequency of low-k occurrence. For example, the significant difference between the rankings of "low" and "k" in 2017-2019 corresponds to the fact that there were many papers about low-temperature processes and low-resistivity.  There have been many reports and discussions in various fields using these three keywords. Figs. 9 to 13 show the word clouds generated from the titles of ADMETA papers every three years. Frequent words in the top 10 are displayed in large font. The words in a slightly smaller font around the top 10 are considered the characteristic topics of that period.  Figure 9 suggests that keywords related to damascene Cu interconnections dominated the period from 2008 to 2010. The papers that received ADMETA AWARD during this period were those dealing with low-k plasma damage, analysis of resistivity problems in Cu interconnects, and the effect of impurities in Cu on resistivity and reliability, and they dealt with the essential performance of Cu interconnects and issues related to scaling (see the AWARD list below).  From 2011 to 2013, keywords such as TSV, wafer, and graphene were seen in the following years, as shown in Figure 10. The ADMETA AWARD for papers on back grinding damage in wafers, TSV, and 3D integration indicates that the ADMETA discussion were expanding.  Figure 11 suggests that from 2014 to 2016, topics from various fields were being discussed without bias towards any particular keyword. The two central words were Cu and process, and ADMETA was the place for discussions focusing on process technology. The ADMETA AWARD for this period was given to those who reported important results in their respective fields, such as CNT, mechanical reliability, and in-situ analysis of Cu surfaces in BTA.  As shown in Table 1, Cu, low-k, and barrier metal were still frequent words during 2017-2019. It suggests that discussions on integrating these words and the technologies above (Graphene, CNT, TSV, 3D, etc.) were central. The ADMETA AWARD for this period was given to Graphene, TSV, and Cu-Cu bonding papers.  Figure 13 shows the word cloud for 2021. Can you predict what kind of discussions will take place and what will be the focus of attention? |
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